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  • Automatic Dicing Saw

    2025/08/12

    The system uses a high-speed rotating diamond blade to make clean, narrow cuts with high accuracy. The system supports automatic or manual alignment a...

  • DAD_dicer.png

  • Deep Reactive Ion Etching (RIE)

    2025/08/12

    This system uses inductively coupled plasma (ICP) source to achieve high-density plasma, enabling deep etching of silicon. It employs the Bosch proces...

  • 488607a0f45671d55bbb3926da5d8a7bf6249e2d.jpg

  • Reactive Ion Etching (RIE)

    2025/08/12

    This system uses capacitive plate (CCP) reactive ion etching with RF power to create controlled plasma environments for precise etching. The built-...

  • pic_rie200nl.jpg

  • Plasma-Enhanced Chemical Vapor Deposition (PECVD)

    2025/08/12

    The system uses a capacitive coupling plate (CCP) with RF power to generate a controlled plasma environment, ensuring precise deposition. It offers ex...

  • samco_PECVD_PD-220NL.jpg

  • Plasma Enhanced Atomic Layer Deposition (PE-ALD)

    2025/08/12

    The system uses an inductively coupled plasma (ICP) source to generate a stable and uniform plasma, allowing for film growth at lower temperatures com...

  • samco_ald.jpg

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Okinawa Institute of Science and Technology Graduate University

Okinawa Institute of Science and Technology Graduate University
1919-1 Tancha, Onna-son, Kunigami-gun
Okinawa, Japan 904-0495

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